Automotive electronics and medical device manufacturers do not lack shielding cans. What they truly need is a systematic solution that concurrently resolves EMC performance, heat dissipation, reliability and cost challenges.BOSI addresses five core industrial dilemmas for you:

Pain Point 1: Heterogeneous Integration of Multiple Materials — Tackle low-frequency magnetic field challenges under 800V high-voltage platforms

For inner-layer low-frequency magnetic field shielding, Permalloy featuring high magnetic permeability is adopted. Through precision stamping and stress relief annealing, we ensure stable performance of ultra-thin high-permeability sheets.The outer layer is made of highly conductive materials — nickel silver or pure copper. It reflects high-frequency Electromagnetic Interference (EMI), dissipates eddy currents, and meanwhile protects the inner high-permeability materials against mechanical damage and corrosion.With 25 years of expertise in material application and precision die technology, BOSI selects high-purity raw materials. A controlled clean production environment and specialized packaging prevent contamination and oxidation during storage. Our products deliver ultra-high flatness, enabling fast soldering with zero discoloration.

Pain Point 2: Heat Dissipation vs. Shielding — Break the design paradox: electromagnetic leakage from ventilation holes, and overheating without openings

Instead of making a forced choice between vented and fully sealed designs, we solve the problem via optimized materials and structural engineering. For shielding cans matched with high-power chips, we recommend high-thermal-conductivity beryllium copper (C17200) or pure copper (C1100).This solution achieves an optimal balance between shielding capability and heat dissipation without significantly increasing material thickness or opening areas. If ventilation holes are indispensable, our sophisticated electromagnetic structural design allows unobstructed air flow through holes, while blocking electromagnetic waves of specific frequency bands.

Pain Point 3: Intelligent Structural Design — Meet waveguide hole requirements for high-frequency components such as 77GHz millimeter-wave radars

We apply stepped or tapered waveguide holes instead of conventional straight-wall holes. Leveraging BOSI’s self-developed electromagnetic simulation algorithm, we optimize the hole wall inclination angle (5°–10°) to balance cutoff frequency and shielding effectiveness, and eliminate signal reflection and resonance.Supported by German CNC micro-prototyping equipment with 0.01mm micro-structure machining capacity, we control the diameter tolerance of waveguide holes within ±0.002mm and positional tolerance below 0.01mm, eliminating signal phase errors caused by hole position deviation.Perturbation structures (e.g., honeycomb protrusions) are designed on the inner walls of shielding cavities to disrupt resonance modes. This shifts the cavity resonance frequency out of the 77GHz operating band and guarantees superior signal purity.